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Title | Wafer Bonding | Semiconductor Packaging | Micro Materials |
Description | Semiconductor Wafer Temporary Bonding Debonding and Device Temporary Protection Reach out to us for innovative semiconductor wafer handling solutions. Our cutting-edge wafer temporary bonding technology and wafer protection solutions will best serve your |
Keywords | N/A |
WebSite | micromaterials-inc.com |
Host IP | 66.96.149.29 |
Location | United States |
Site | Rank |
US$1,461,507
Last updated: 2023-05-16 11:48:07
micromaterials-inc.com has Semrush global rank of 7,242,051. micromaterials-inc.com has an estimated worth of US$ 1,461,507, based on its estimated Ads revenue. micromaterials-inc.com receives approximately 168,636 unique visitors each day. Its web server is located in United States, with IP address 66.96.149.29. According to SiteAdvisor, micromaterials-inc.com is safe to visit. |
Purchase/Sale Value | US$1,461,507 |
Daily Ads Revenue | US$1,350 |
Monthly Ads Revenue | US$40,473 |
Yearly Ads Revenue | US$485,670 |
Daily Unique Visitors | 11,243 |
Note: All traffic and earnings values are estimates. |
Host | Type | TTL | Data |
micromaterials-inc.com. | A | 3600 | IP: 66.96.149.29 |
micromaterials-inc.com. | NS | 3600 | NS Record: ns1.ipage.com. |
micromaterials-inc.com. | NS | 3600 | NS Record: ns2.ipage.com. |
micromaterials-inc.com. | MX | 3600 | MX Record: 30 mx.micromaterials-inc.com. |
micromaterials-inc.com. | TXT | 3600 | TXT Record: v=spf1 ip4:66.96.128.0/18 ?all |
Skip to footer Home Equipment Materials Services Contact Us Home Equipment Materials Services Contact Us Semiconductor Wafer Temporary Bonding Debonding and Device Temporary Protection Specialist Enable advanced thin semiconductor manufacturing with higher yield and reduced cost. KNOW MORE AirDebond® Air-Assited Mechanical Debonding Our breakthrough AirDebond® technology enables wafer stacks to be debonded with extremely low-stress air jetting, giving our customers a cleaner, greener, and faster thin wafer handling experience. Best of all, AirDebond® technology requires no physical contact with the wafer and bonding adhesive during the entire debonding process, maximizing the protection of our customers’ valuable wafers. Your browser does not support the video tag. Helpful PDF’s: Air Jetting Debonding for Thin-Wafer/Panel and Fan-Out Wafer-Level Package Processing High Throughput Air Jetting Wafer Debonding for 3D IC and MEMS Manufacturing High Throughput Low-Stress Air Jetting |
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Domain Name: MICROMATERIALS-INC.COM Registry Domain ID: 1884213801_DOMAIN_COM-VRSN Registrar WHOIS Server: whois.domain.com Registrar URL: http://www.domain.com Updated Date: 2021-10-26T16:07:05Z Creation Date: 2014-11-08T06:55:07Z Registry Expiry Date: 2022-11-08T06:55:07Z Registrar: Domain.com, LLC Registrar IANA ID: 886 Registrar Abuse Contact Email: compliance@domain-inc.net Registrar Abuse Contact Phone: 602-226-2389 Domain Status: clientTransferProhibited https://icann.org/epp#clientTransferProhibited Domain Status: clientUpdateProhibited https://icann.org/epp#clientUpdateProhibited Name Server: NS1.IPAGE.COM Name Server: NS2.IPAGE.COM DNSSEC: unsigned >>> Last update of whois database: 2022-01-25T08:17:18Z <<< |