micromaterials-inc.com valuation and analysis

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Title Wafer Bonding | Semiconductor Packaging | Micro Materials
Description Semiconductor Wafer Temporary Bonding Debonding and Device Temporary Protection Reach out to us for innovative semiconductor wafer handling solutions. Our cutting-edge wafer temporary bonding technology and wafer protection solutions will best serve your
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WebSite micromaterials-inc faviconmicromaterials-inc.com
Host IP 66.96.149.29
Location United States
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micromaterials-inc.com Valuation
US$1,461,507
Last updated: 2023-05-16 11:48:07

micromaterials-inc.com has Semrush global rank of 7,242,051. micromaterials-inc.com has an estimated worth of US$ 1,461,507, based on its estimated Ads revenue. micromaterials-inc.com receives approximately 168,636 unique visitors each day. Its web server is located in United States, with IP address 66.96.149.29. According to SiteAdvisor, micromaterials-inc.com is safe to visit.

Traffic & Worth Estimates
Purchase/Sale Value US$1,461,507
Daily Ads Revenue US$1,350
Monthly Ads Revenue US$40,473
Yearly Ads Revenue US$485,670
Daily Unique Visitors 11,243
Note: All traffic and earnings values are estimates.
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HtmlToTextCheckTime:2023-05-16 11:48:07
Skip to footer Home Equipment Materials Services Contact Us Home Equipment Materials Services Contact Us Semiconductor Wafer Temporary Bonding Debonding and Device Temporary Protection Specialist Enable advanced thin semiconductor manufacturing with higher yield and reduced cost. KNOW MORE AirDebond® Air-Assited Mechanical Debonding Our breakthrough AirDebond® technology enables wafer stacks to be debonded with extremely low-stress air jetting, giving our customers a cleaner, greener, and faster thin wafer handling experience. Best of all, AirDebond® technology requires no physical contact with the wafer and bonding adhesive during the entire debonding process, maximizing the protection of our customers’ valuable wafers. Your browser does not support the video tag. Helpful PDF’s: Air Jetting Debonding for Thin-Wafer/Panel and Fan-Out Wafer-Level Package Processing High Throughput Air Jetting Wafer Debonding for 3D IC and MEMS Manufacturing High Throughput Low-Stress Air Jetting
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micromaterials-inc.com Whois Information
Domain Name: MICROMATERIALS-INC.COM
Registry Domain ID: 1884213801_DOMAIN_COM-VRSN
Registrar WHOIS Server: whois.domain.com
Registrar URL: http://www.domain.com
Updated Date: 2021-10-26T16:07:05Z
Creation Date: 2014-11-08T06:55:07Z
Registry Expiry Date: 2022-11-08T06:55:07Z
Registrar: Domain.com, LLC
Registrar IANA ID: 886
Registrar Abuse Contact Email: compliance@domain-inc.net
Registrar Abuse Contact Phone: 602-226-2389
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>>> Last update of whois database: 2022-01-25T08:17:18Z <<<